Scientists have announced a revolutionary solution for the rapid design exploration and optimization of three dimensional stacked ICs (3D SIC). Developed in close collaboration with IMEC, independent ...

The integration of heterogeneous chiplet technology has fundamentally transformed semiconductor design, enabling the efficient creation of sophisticated system-in-packages by assembling pre-designed ...

At the 46th Design Automation Conference in San Francisco last month, attention turned to a discussion of how to extend the momentum of Moore’s Law into the next decade. One plausible solution, ...

Autodesk has used GDC 09 to announce new versions of two of its primary middleware technologies. HumanIK 4 updates the company’s animation middleware, while Kynapse 6 offers an improved edition of the ...