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Through-silicon-via (TSV) is a promising three-dimensional (3D) packaging technology due to its advantages of high performance, reduction in packaging volume, low power consumption, and ...

A new study finds resilience is a dynamic process, rather than a fixed trait - and suggests this may have significant ramifications for the business world. A new study finds that resilience is a ...

The oil and gas production explosion is driving the renaissance of the chemical and process industries in North America. With low-cost natural gas comes low-cost feedstock for many chemical compounds, ...

A large-scale, high-speed, long-runout landslide occurred in Xinmo Village, Maoxian, Sichuan Province, China, on June 24, 2017. It was characterized by fast sliding speed, rapid volume growth, and ...