DIGITIMES

DIGITIMES Insight: Taiwanese firms lead in FOPLP as overseas rivals race to catch up

Taiwanese chip packaging firms are advancing fan-out panel-level packaging (FOPLP) and glass-substrate development as AI processors demand ever-larger reticle sizes and more complex packaging. Their ...
DIGITIMES

TSMC's 310mm push threatens Samsung's PLP lead

Samsung Electronics commercialized fan-out panel-level packaging (FOPLP) before rivals, using the technology in mobile and ...
Circuits Assembly Online Magazine

FOPLP Curing and Annealing Oven Adds Dedicated 310mm Chamber Configuration

AQWOL-5S Smart Clean Room and Inert Gas Oven, aimed at OSAT and substrate makers running fan-out panel level packaging (FOPLP) lines. The chamber is sized to a single panel format, against the ...
Morningstar%2c Inc.

Manz Asia Successfully Delivers World's First 310mm × 310mm Panel-Level Packaging ECD Production System

World's first 310mm × 310mm panel-level packaging (PLP) Electrochemical Deposition (ECD) production system delivered to customer line Omni x-series covering 310mm, 510mm, and 700mm platforms, enabling ...
Opinion
tw.stockOpinion

群創布局FOPLP技術，突破Chip Last與HIPoS異質整合搶攻AI封裝商機

【財訊快報／記者張家瑋報導】SEMICON Taiwan 2026開跑，面板大廠群創(3481)繼Chip First與TGV技術後，宣布首度公開Chip Last關鍵技術平台，並搭配高密度異質整合（HIPoS）平台與一站式面板級測試服務，宣示全面跨足次世代先進封裝供應鏈。群創表示，下一階段，將積極推進客戶驗證，預計於2027年下半年投入量產，積極切入AI、高效能運算等次世代先進封裝供應鏈。研調機 ...