Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.

This study investigated the effectiveness of heat shield placement locations during the rework process to avoid thermal and mechanical damage to adjacent ball grid array components and their solder ...

There is an ongoing need to improve the understanding and reliability of Pb-free solders, particularly for applications with high consequences of failure in the medical, automotive, aerospace and ...