Advanced Packaging Has Become the Bottleneck Intel (INTC) is attempting to reposition itself in the semiconductor value chain ...

The new arm will focus on three areas: packaging intelligence, supply chain optimisation and next-generation materials.

Taiwanese chip designer MediaTek said it has appointed former ‌TSMC executive Douglas Yu as a part-time ‌adviser as it steps ...

Applied Materials, Inc. today announced it has entered into a definitive agreement with ASMPT Limited (HKEX: 0522) to acquire its NEXX business, a leading supplier of large-area advanced packaging ...

Qnity Electronics, Inc. Q sits in the middle of a fast-moving artificial intelligence (AI) hardware buildout that is reshaping materials demand across the semiconductor value chain. The company’s ...

Google may use Intel Foundry’s EMIB packaging for TPUv8e, boosting Intel’s AI chip ambitions and reshaping advanced ...

Amkor Technology stays a Buy with a $100–$110 target, driven by AI advanced packaging demand, earnings beats, and 2026 growth ...

Packaging is more than a product vessel. It serves as a strategic tool for storytelling, trust-building, and delivering immersive brand experiences. Retailers and brands that leverage packaging as a ...

Digital packaging bridges the gap between limited physical space and the growing demand for transparency, playing a crucial role in delivering sustainability insights that benefit brands and consumers ...

The Singapore semiconductor startup is expected to ship more than a billion devices including advanced chiplet-based products ...

Explore packaging careers at Interpack 2026 with tours, forums, and hands-on demos for students and young professionals ...