Samsung Electronics is currently dedicated to the R&D of 11nm level DRAM and ninth-generation 3D NAND Flash. The goal is to raise integration to the highest level in the industry, realize its existing ...
Belgian research lab Imec has revealed 3D stacked memory-on-GPU AI processor thermal data at IEDM (IEEE International Electron Devices Meeting) this week. The data comes from a thermal STCO ...
With the increased prevalence of generative AI, the demand for High Bandwidth Memory (HBM) is rapidly rising, leading to heightened competition in stacking. For HBMs, a higher stack means the ...
Bernin (France), June 3, 2025 – Soitec (Euronext – Tech Leaders), a world leader in the design and production of innovative semiconductor materials, today announced a strategic collaboration with ...
Something to look forward to: The memory industry is known for its conservative approach, often favoring incremental improvements over revolutionary changes. But as we look toward the end of the ...
Check out our coverage of the 2023 Flash Memory Summit. 3D NAND chips are the skyscrapers of the semiconductor industry, linking together layers of flash memory with short vertical interconnects that ...
Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization ...
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