The global leader in optical communications unveils an expanded portfolio of high-speed interconnects—including 800G ...

Lightmatter, the leader in photonic (super)computing, today announced a technical collaboration with Cadence to develop co-packaged optics (CPO) solutions that integrate Cadence’s silicon-proven, high ...

Marvell's $3.8B acquisitions of Celestial AI and XConn target optical interconnects and CXL switching for next-gen AI infrastructure, challenging Broadcom's dominance.

Lightmatter ®, the leader in photonic interconnect solutions for AI, and Global Unichip Corp. (GUC), the Advanced ASIC leader and a key enabler for hyperscaler AI infrastructure, today announced a ...

HSINCHU, Taiwan--(BUSINESS WIRE)--Edgecore Networks, a global leader in open infrastructure solutions, unveiled its new Phoenix AMX3200 optical coherent transponder and muxponder, engineered for ...

NEW PROVIDENCE, N.J.--(BUSINESS WIRE)--Nubis Communications, Inc. launched today from stealth mode, revealing a breakthrough optical technology platform and its first product. The company announced ...

November 9, 2011. Molex Inc. announced it has demonstrated what it calls the industry’s first single chip CMOS photonics-based 100 Gbps optical interconnect to support next-generation cloud computing ...

USI announces that its wholly-owned subsidiary, Universal Optoeletronics Co., Ltd., completed the acquisition of a controlling stake in EugenLight Technologies.

Researchers have developed new polymer materials that are ideal for making the optical links necessary to connect chip-based photonic components with board-level circuits or optical fibers. These ...

Ciena buys Nubis for $270 million to boost AI-ready data center interconnects, aiming for faster, efficient and scalable ...

NPC50503 1.6T NPO Laser Integrated Transmitter with OSPic™ all-optical signal processor enables in-demand speeds at critical architecture power efficiency in small form factor solution TEL AVIV, ...

San Jose, Calif. — Optical technology is being eyed as a way to boost communications between chips in multiprocessor systems and will be the subject of a proposed specification to be submitted to a ...