Until recently, signal integrity has been a concern relegated predominantly to multi-gigabit serial interface design. Today, it is an aspect of design that engineers building high-speed parallel ...

The present trends in technology — such as increasing demand for computational power from CPUs and GPUs, connectivity driven by Internet of Things (IoT), data demands around connected and self-driving ...

As every engineer learns at an early stage, clock edges must be obeyed. In the digital domain, synchronization through global and local clock trees, slew rate and rising/falling times all combine to ...

With the development of technologies such as artificial intelligence, high-performance computing, cloud computing, and ultra-high-speed networks, massive amounts of computing and transmission data ...

Cadence is trying to automate more aspects of the chip design process with Integrity 3D-IC, a suite of software tools it says can help engineers develop faster, less power-hungry chips using 3D ...

The relentless march of semiconductor scaling continues to reshape the packaging landscape, driven by Moore’s Law and the demand for higher performance in increasingly compact form factors [1]. Over ...