TOKYO--(BUSINESS WIRE)--Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it will launch a 50W silicon radio-frequency (RF) high-power metal-oxide semiconductor field-effect ...

Reliable versatile analog transistor targets More Than Moore applications bringing differential advantage for smart sensors, ...

CEA-Leti and STMicroelectronics presented results at IEDM 2025 showcasing the key enablers for a new high-performance and versatile RF Si platform co-integrating best-in-class active and passive ...

Chipmaker Broadcom Inc. today debuted four RF front-end modules for powering routers that use Wi-Fi 7, a new wireless networking standard. The company says its modules can also be used to build Wi-Fi ...

Available in 44 values from 0.4 to 39 pF, the HPC0201A is offered as the first silicon-based RF capacitor with a 0201-sized footprint. Suiting wireless communications products such as VCOs, filter ...

Silicon Labs’ new MGM111 module is the first in this comprehensive family of multiprotocol modules based on the Mighty Gecko system-on-chip (SoC) device. The MGM111 module is supported by Silicon Labs ...

EE Times’ Silicon 100, now in its 25th edition, evaluates startups on both quantitative and qualitative attributes. These factors include technology-readiness level, intellectual property, strategic ...

Trinasolar has also increased the power efficiency for its perovskite-silicon tandem modules to 829W. Image: Trinasolar. Chinese solar manufacturer Trinasolar has reportedly achieved a 30.6% ...

POET Technologies Inc. (NASDAQ:POET) revealed that interconnect solutions provider Foxconn Interconnect Technology has chosen its silicon photonics integrated circuits (Silicon PIC) for the 800G and 1 ...

Scientists led by Saudi Arabia’s King Abdullah University of Science and Technology (KAUST) have fabricated a monolithic perovskite-silicon tandem photovoltaic device which they claim shows minimized ...

Joint Work Shows Next Generations of RF and Optical Front-End Modules (FEM) Could Be Built by the Assembly of Different Silicon Technologies at Wafer Level, Allowing the Dense Co-integration of ...