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Industry-First! SpiroxLTS Reveals the True Quality of TGV Laser-Modified Vias Accelerating TGV Mass Production

HSINCHU, June 17, 2025 /PRNewswire/ -- Professional semiconductor equipment provider Spirox Corporation (TWSE: 3055) has introduced the industry-first SpiroxLTS (Spirox Laser Tomography Scanning) ...

BOE Enters Glass Substrate Market for AI Semiconductors in Earnest, Achieving 15:1 TGV Aspect Ratio

Character SummaryChina's BOE is accelerating the mass production of glass substrates for AI semiconductors. The company showcased a glass core with a 15:1 TGV aspect ratio and is planning investments ...
Taiwan News

Spirox Launches High-Speed TGV Crack Inspection System to Support High-Volume Glass Substrate Inspection

Spirox hosted the “2026 Advanced Packaging Technology Forum,” focusing on the development and challenges of Glass Core and TGV technologies for next-generation AI/HPC applications. Pictured from left ...
아시아경제

JNTC Succeeds in World’s First Development of High-Difficulty TGV Glass Substrate with 2.0mm Thickness

JNTC has entered the full-fledged stage of expanding the global supply chain for TGV glass substrates. JNTC (Co-CEOs Namhyuk Cho and Yoonjung Jang), which is growing as a global advanced materials ...