Increasing the yield of wafers is one way to attack the current global chip shortage. One possibility to reduce losses is a laser processing method called wafer stealth dicing. Here, laser power is ...

Semiconductor manufacturing depends heavily on the ability of machine-vision systems to correctly locate, identify, and align wafers and circuits for testing. Inaccuracy in any of these activities can ...

The precision required poses several challenges for testing and packaging procedures, necessitating the precise alignment of fiber optic devices in high-throughput production settings. PI offers ...

With a focus on parallel optimization and nanoscale accuracy, precision positioning specialist PI is streamlining the optical alignment, test and packaging of quantum photonic devices Parallel lines: ...