Optical 3D metrology enables fast, non-contact surface roughness measurement of defects and roughness for precise ...

SEMVision™ H20 enables better and faster analysis of nanoscale defects in leading-edge chips Second-generation “cold field emission” technology provides high-resolution imaging AI image recognition ...

A technical paper titled “SEMI-PointRend: Improved Semiconductor Wafer Defect Classification and Segmentation as Rendering” was published (preprint) by researchers at imec, University of Ulsan, and KU ...

SiC is extensively used in microelectronic devices owing to its several unique properties. However, low yield and high cost of the SiC manufacturing process are the major challenges that must be ...

Applied Materials has launched the SEMVision™ H20, a new defect review system designed to enhance the analysis of nanoscale defects in advanced semiconductor chips. This system utilizes cutting-edge ...

Advances in technology offer many ways to improve efficiency and reduce costs without impacting quality through automated inspection tools. The full potential of these tools cannot be fully leveraged ...