GaN is especially well-established in low-power applications like chargers for personal electronics, while silicon and SiC ...

Accelerate tool development and reduce the consumption of physical resources like silicon wafers, chemicals, and gases.

Wide bandgap materials and advanced packaging are revolutionizing power, but thermal and integration challenges persist.

The MEMS & Imaging Sensors Summit demonstrated how collaboration, sustainability, and innovation are driving the sensor ...

This enables the EUV lithography era of today, which is likely to continue for the foreseeable future. Initially, EUV became ...

A New Class of Memory for the AI Era” was published by researchers at Microsoft. Abstract “AI clusters today are one of the ...

Semiconductor Engineering sat down with Dan Brewer and Srikanth Kommu, co-CEOs at Brewer Science, to talk about current and future changes in materials used in semiconductor manufacturing and adjacent ...

Delamination occurs when there is a mismatch in coefficients of thermal expansion (CTE) between the encapsulate materials, such as the mold compound used to encapsulate the semiconductor chip and the ...

How to prevent complex systems from freezing up.

Companies poured billions into fabs and facilities around the world as regions continue to build self-sufficiency and form ...

Plus, check out the blogs featured in the latest Low Power-High Performance newsletter: Fraunhofer’s Andy Heinig explains how ...

A new technical paper titled “Modular Compilation for Quantum Chiplet Architectures” was published by researchers at ...