Researchers from La Trobe University, Deakin University, Monash University, and Swinburne University of Technology developed ...

Morgan Stanley (May 14, 2025) predicted a humanoid robot market (let’s call this GPR: general-purpose robots) of $5 trillion ...

New DRAM standard aims to solve a critical bottleneck.

A new technical paper titled “In Situ Atomic-Scale Investigation of Electromigration Behavior in Cu–Cu Joints at High Current ...

Aware Fine-Tuning of Spiking Q-Networks on the SpiNNaker2 Neuromorphic Platform” was published by researchers at TU Dresden, ...

How AI is reshaping EDA, and how it will help chipmakers to focus on domain-specific solutions.

A Framework for Cross-Tool Virtual Prototyping” was published by researchers at RWTH Aachen University, MachineWare and ...

XR goggles and puck devices Gaming is one of the first applications for extended reality (XR), virtual reality (VR), and ...

A new technical paper titled “Thermal characteristics of a double intra-cavity contact VCSEL for cryogenic optical links” was ...

The key element of SIOV is the Scalable Device Interface (SDI), a “lightweight” and composable virtual interface designed for ...

LPDDR6; hardware root of trust; PCB crosstalk; structured design data; multiphysics for multi-die; IoT shifts; Scope 3 ...

Abhi agreed. “We have to trust in that hallucination, that innovation to provide us with things that we’ve never seen before, ...