Supercomputers search for corona medication | AT&S
Nov 10, 2020 · Japan’s Fugaku supercomputer, which is currently considered the world’s fastest computer, is currently also employed by researchers for the development of drugs against …
High-performance computers: AT&S works on microchips of the …
Jan 10, 2023 · After decades of technological progress based on the continuous miniaturisation of transistors, the semiconductor industry is now approaching a fundamental limit. Future chip …
Innovation | AT&S
Dec 19, 2025 · The electronics industry is characterised by ongoing rapid development and regular technological breakthroughs. AT&S products and processes meet the highest …
Weather research with high-tech support | AT&S
Nov 24, 2020 · Graphics processors are the key The “Piz Daint” high-performance computer in Switzerland ranks tenth in the most recent top-500 list of the world’s fastest computers from …
Supercomputer suchen nach Corona-Medikamenten | AT&S
Nov 10, 2020 · Auch Japans Fugaku-Supercomputer, der derzeit als der schnellste Rechner der Welt gilt, wird derzeit von Forschern genutzt, um COVID-Medikamente zu entwickeln. …
When smaller is no longer possible, microchips become megachips
Aug 12, 2022 · The physical limits of the miniaturization of microchips have been discussed for years. For electronic gadgets to further overcome these barriers to increase performance, …
Tracing COVID-19 | AT&S
Nov 19, 2020 · Miniaturized and highly sensitive AT&S PCBs are needed to get fast and accurate results from COVID-19 tests.
State Secretary Tursky emphasises the goal of European chip …
Nov 21, 2025 · During his visit of the AT&S headquarters in Leoben, State Secretary Florian Tursky was given an insight into the area of microelectronics that is indispensable for …
COVID-19 auf der Spur | AT&S
Nov 19, 2020 · Und egal ob es um lebensrettende Beatmungsgeräte, Supercomputer im Einsatz für die Impfstoff-Forschung oder Tests zum Erkennen einer COVID-Infektion geht: …
IC Substrates | AT&S
Discover high-performance AT&S IC substrates for advanced high-density interconnect and flip chip technologies – engineering to drive semiconductor innovation.